POP implementation and rework
Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.
POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：ケイ・オール
- 価格：Other
